11-27

Developments-of-VCSEL-based-transceivers-for-Co-Packaging-from-IBM

11-27

FOWLP-and-Si-Interposer-for-High-Speed-Photonic-from A star and IME

11-26

1.6 Tbps FOWLP-Based Silicon Photonic Engine for Co-Packaged Optics - from Rain Tree Photonics Pte Ltd, A star and IME

11-26

可见光WDM滤波器-绝热ADC+MWBG

11-25

先进3D封装-3.2Tbs光电共封装引擎在混合规模数据中心网络-Cisco

11-22

博通CPO性能指标

11-16

仿真的层级划分

11-12

在CPO（共封装光学）之外：将光学器件放在硅中介层上的动机和方法-from-NVDIA

10-23

VPI中的器件建模-微环调制器

10-21

基于超构材料的紧凑型滤波器-仿真优化2