12-05

联合封装光学（CPO）：现状、挑战和解决方案

12-03

3D-photonics-for-ultra-low-energy-high-bandwidth-density-chip-data-links

12-02

Co-Designed_Silicon_Photonics_Chip_I_O_for_Energy-Efficient_Petascale_Connectivity-DAPPA-LIPSON-BERGMAN-Columbia-Xscape-Photonics-Inc-Fort-Lee

12-02

photonics-for-die-to-die-interconnects-from-AyarLab

11-27

用于光收发器中硅光子引擎的2.5D异构集成-from Marvell-2022

11-27

Developments-of-VCSEL-based-transceivers-for-Co-Packaging-from-IBM

11-27

FOWLP-and-Si-Interposer-for-High-Speed-Photonic-from A star and IME

11-26

1.6 Tbps FOWLP-Based Silicon Photonic Engine for Co-Packaged Optics - from Rain Tree Photonics Pte Ltd, A star and IME

11-26

可见光WDM滤波器-绝热ADC+MWBG

11-25

先进3D封装-3.2Tbs光电共封装引擎在混合规模数据中心网络-Cisco